Cee® Apogee® Spin Coater: Redefining precision with a compact design, ver
Cee® Apogee® spin coater: cutting-edge precision, superior chemical compat
Cee® Apogee® spray/puddle developer: Compact, versatile HDPE-built unit wi
Elevate development with Cee® Apogee® 450 Developer: top-tier performance
Cee® Apogee® Bake Plate: Robust, user-friendly, and precise thermal perfor
Elevate substrate baking with Cee® Apogee® 300 Bake Plate—robust, intuitiv
Apogee® Bonder: Accelerated development, high precision, void-free bonding
Optimize compound semiconductor development with Cee® 1300CSX thermal slide
Apogee® Mechanical Debonder: Room-temperature wafer debonding
3rd floor, 1, Sharadanagar, Uttarahalli Main Rd, Vasanthapura, Bengaluru, Karnataka 560061
080 2666 5684/5
GMS has been closely involved in semiconductor and microelectronics core component manufacturing for over 20 years. Wire bonding in particular is one such technology that has been adapted from our semiconductor industry to build automated scalable lithium battery packs.
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