Wire Bonding - Semi-Automatic - 5610 GOLD BALL BONDER | Equipments


5610 GOLD BALL BONDER

  • The PC controlled moving tables allows any number of bonds to be stored automatically from a stored program.
  • Results can be analysed and output immediately or exported in a number of data base formats forsubsequent anaysis as desired.
  • Exchangeable measurement cartridges ensure rapid conversion to different force ranges.
  • Additional heads for shear,peel and tweezer testing with customer- specific tools and jaws are available.

Applications and Benefits

The 5610 can also be used as Thin Wire Wedge Wedge or Heavy Wire as well as pull-/shear tester by simply replacing the bond head and loading the appropriate software.

Contact Us

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Phone Number

+91 80 26665684

Email

info[at]gms-india.com

Address

Global Marketing Services
263, 3rd Main, ISRO Layout,
Bangalore – 560078 INDIA.