Wire Bonding - Fully-Automatic - 8650-Thick wire | Equipments


8650 – Heavy Wire

  • Heavy wire bonding for aluminum wire from 100 up to 500 µm diameter
  • Heavy wire bonding for copper wire from 100 up to 300 µm diameter
  • Wedge lengths of 50 up to 70 mm even for extreme bonding requirements
  • Stitch- or chain bonds of any length
  •  Clip-on-wire guide for quick exchange
  •  Deformation Limit Control (DLC) for real-time quality checks

Applications and Benefits

Exchangeable measurement cartridges ensure rapid conversion to different force ranges.The calibration curves of all measurement cartridges are stored internally;additional heads for shear,and tweezer testing with customer-specific tools and jaws are available.

Contact Us

Your Trusted Microelectronics Solutions Partner

Phone Number

+91 80 26665684

Email

info[at]gms-india.com

Address

Global Marketing Services
263, 3rd Main, ISRO Layout,
Bangalore – 560078 INDIA.