Wire Bonding - Semi-Automatic - F&S BONDTEC 5830 SEMI-AUTOMATIC BONDER | Equipments


5830 AUTOMATIC THIN WIRE WEDGE BONDER

  • The Wedge-Wedge Version of our new Series 58 automatic wirebonder with exchangeable Bondheads.
  • A fully automatic mode makes it ideally suited for medium-scale production.
  • Parts to be bonded are fed manually by the operator, but the bonds are produced completely without operator influence. 

Applications and Benefits

Single bonds can be made within seconds,making the machine perfect for R&D,pilot manufacturing and middle volume production.

Contact Us

Your Trusted Microelectronics Solutions Partner

Phone Number

+91 80 26665684

Email

info[at]gms-india.com

Address

Global Marketing Services
263, 3rd Main, ISRO Layout,
Bangalore – 560078 INDIA.