Wire Bonding - Semi-Automatic - 5630 THIN WIRE WEDGE BONDER | Equipments


5630 THIN WIRE BONDER

  • The wedge-wedge bond head 5630 processes thin aluminium or gold wires from 17,5 up to 75 µm diameters. The wire is fed at a standard angle of 45° and can be adapted to 60°.
  • Several ultrasonic frequencies between 60 and 140 kHz are available, making the bond process extraordinarily adaptable to different bond surfaces and geometries.

Applications and Benefits

The 56302 can also be used as Gold wire or Alu Heavy wire  Bonder as well as pull-/shear tester by simply replacing the bond head and loading the appropriate software.

Set up time: ~5 minutes

Contact Us

Your Trusted Microelectronics Solutions Partner

Phone Number

+91 80 26665684

Email

info[at]gms-india.com

Address

Global Marketing Services
263, 3rd Main, ISRO Layout,
Bangalore – 560078 INDIA.