Wire Bonder F & K M17S – the first and only fully automatic all-in-one bonder in the world.
- M17 benefits from an innovative platform strategy with a number of work areas, whereby the different wirebond technologies and transducer frequencies can be deployed on the same machine base.
- Integrated thin wire and deep access applications in a single machine platform through fast system change-over
- Solutions for any customer requirements from prototyping to series manufacture
- Ensures repeatable bond quality through patented BPC for real-time adjustment of the bond parameters with varying material surfaces
- Ensures process transparency through seamless integration in industry 4.0/IOT procedures
- Shortens set-up times through intelligent pattern recognition with multiple structure and feature identification
Applications and benefits
A process safe, all-in-one bonder for any demanding wire bonding process, particularly suitable for ball-wedge bonding in packages (deep access).
Joining Technology Wire Bonding
- Wedge-Wedge Fine Wire
- Deep Access Wedge-Wedge Fine Wire
- Wedge-Wedge Heavy Wire
- Wedge-Wedge Heavy Ribbon