Solstice Electro Plating Systems
Company: Classone Technologies
Features: Available in 3 variants LT, S4 and S8 with 2, 4 and 8 chamber respectively.
Manual to fully Automatic operation.
For Plating, Cleaning and Etching in MEMS, TSV and 3D Interconnect Technologies.
Plating of Cu, Ni, Sn, Ti, alloys and more.
Wafer sizes from 75mm to 200mm.
Superior control, higher uniformity.
For thin or bonded, transparent or opaque substrates.
Powerful Windows based software.
Broad process flexibility.