| Vendor |
|
Products |
Angstrom
Sciences Inc.,USA
|
|
Sputter
Magnetrons (Circular/Rectangular)
Evaporation Material
Sputtering targets |
Cemat
Silicon S.A., Poland |
|
Silicon
Wafers (CZ)
DSP Wafers for MEMS
Epi Wafers |
Dou
Yee Enterprises, Singapore
|
|
Various
ESD and Cleanroom consumables |
EMS,
USA
|
|
Epoxies,
Adhesives and Sealants for Microelectronics and Industrial Applications |
General
Ceramics LLC, USA |
|
Metal
Packages for Hybrids |
Microchem,
USA
|
|
Negative
Photoresists for MEMS
PMMA resists
Lift off resists |
Spectrum
Semiconductor Materials, USA
|
|
Ceramic
Packages & Combo lids for hybrids and microwave devices |
QPL,
Hong Kong
|
|
Etched
and Stamped leadframes |
Monocrystal, Russia
|
|
SOS Wafers |
Isonics, USA |
|
SOI Wafers |
SPT Asia,
|
|
Bonding Tools for die & wire bonders |
Pozzetta, USA
|
|
Storage boxes for wafers & mask plates |
Beijing
Ju Bo Photoelectric Technology Co. China
|
|
Low
cost optical coating material |
CM
Electron Co. Ltd, Korea |
|
Au
bonding wire |
Plan
Optik GmbH, Germany |
|
Glass
wafers for MEMS |
SPM
|
|
Au
bonding wire & ribbon
Al bonding wire
Cu bonding wire
Solder alloys |
LKT Kirchner & Co, Germany
|
|
Shipley positive photoresists
|
