MICROTECH has developed a complete microlithographic process for cylindrical surfaces. Such a process is suited for the fabrication of thin film coils, line arrays or generic patterns on the side surface of a cylinder, through the following steps:
Plasma-Therm’s 790™ platform is the latest in the 790™ Series of cost-efficient systems. Has been field demonstrated to have low maintenance requirements and is easily operated in R&D through high production environments.
� Very high dimensional accuracy and no thermal deformation
� The surface cured and protected by Kanigen (C(K) catalytic Nickel    Generation) plating
MicroChem offers a broad line of ancillary products for resist thinning, edge bead removal, development, rinse and removal of photoresists. These products work effectively with our PMGI, LOR, PMMA & copolymer and SU-8 resists as well as with many other commercially available photoresist products. Competitively priced, these ancillary products and are available in a wide range of package sizes.
EPI stands for epitaxy. These scrubbers are developed especially for abatement of epitaxy processes. Special care was given to the high safety standard in respect to the hydrogen carrier gas. After scrubbing, the hydrogen is diluted in controlled way below LEL.
• All the works necessary for decap are realized through Auto Decaper
• The automated robot decapsulation system that has been developed first in the world
• The functions of milling, etching, heating, acetone cleaning, drying, ultrasonic cleaning and vision inspection available
AutoRez-2101™ Product Code: PCC-2101™ Process Control Cystems Inc. Category: Equipments Features: • SHEET RESISTIVITY: 1 milliohm per square to 10 megohm per square. • BULK RESISTIVITY: Program any substrate thickness up to 100 mils • PROGRAMMABLE CURRENT FORCE: Wide range of forced current from 200nA to 200mA.
Automated Wafer Bond Inspection
The AW200™ Series is a high-capacity, high-throughput automated C-SAM® system designed to deliver maximum sensitivity for the evaluation of bonded wafers in applications such as SOI, MEMS and others. Since the materials used in these applications are very transparent to ultrasound, Sonoscan uses proprietary high acoustic frequency lenses, which are designed in-house, to obtain the most detailed images. The AW200 Series can detect voids smaller than 5 microns in diameter between two wafers and delamination with the separation between the wafers as thin as 200 Angstroms.
